G.Skill Announces DDR4-5333 Memory Kits for Intel Rocket Lake

Designed with a focus on Intel’s latest 11th generation Rocket Lake processors and the new memory controller ratios, G.Skill has announced a wave of new memory kits designed to squeeze as much performance out of the platform. The new memory kits for Z590 and Rocket Lake feature speeds of up to DDR4-5333. They will be made available across multiple lines of its range, including the premium Trident Z Royal, Trident Z RGB, and the more affordable Ripjaw V series.

With memory performance and control getting some extra features with Intel’s 11th gen desktop, the Z590 chipset with Rocket Lake processors now supports geared memory ratios between the memory controller and the DRAM data rates. The ability of Intel’s memory controller in a 1:1 gear ratio can vary, certainly under ambient cooling methods, and not all of Intel’s silicon can handle such high frequencies. This is where the gear ratio option becomes beneficial, taking some of the strain off the memory controller and allowing for high frequencies, with G.Skill capitalizing on this with its new memory kits up to DDR4-5333.


G.Skill’s Trident Z Royal DDR4 Memory in Gold

The new G.Skill memory kits designed for Intel’s Z590 (with Rocket Lake) start from DDR4-4266 with CL19 ratings, with two available capacities: dual-channel 32 GB (2×16) and 64 GB (2×32) kits. Also set to be available include DDR4-4400 kits with CL17 and CL18 latencies, including an operating voltage of 1.50 V in both the 32 GB and 16 GB kits.

Moving up, there’s one kit of DDR4-4600 with CL20 with a total capacity of 64 GB (2 x 32 GB) and three different flavors of DDR4-4800; CL17 and CL18 with 2 x 8 GB kits, and CL20 with 2 x 16 GB. There’s one 32 GB (2 x 16 GB) kit at DDR4-5066 with CL19 and an operating voltage of 1.6 V, with one kit maxing out at DDR4-5333 and CL21 latencies, with 2 x 8 GB memory sticks.

G.Skill Memory For Intel Z590 (Rocket Lake)
Rating (MT/s) Latency Voltage Capacity
DDR4-4266 19-26-26-46
19-26-26-46
1.45 V
1.50 V
32 GB (2 x 16 GB)
64 GB (2 x 32 GB)
DDR4-4400 17-18-18-38
18-24-24-44
1.50 V
1.50 V
32 GB (2 x 16 GB)
16 GB (2 x 8 GB)
DDR4-4600 20-30-30-50 1.50 V 64 GB (2 x 32 GB)
DDR4-4800 17-19-19-39
19-28-28-48
20-30-30-50
1.60 V
1.50 V
1.55 V
16 GB (2 x 8 GB)
16 GB (2 x 8 GB)
32 GB (2 x 16 GB)
DDR4-5066 20-30-30-50 1.60 V 32 GB (2 x 16 GB)
16 GB (2 x 8 GB)
DDR4-5333 22-32-32-52 1.60 V 16 GB (2 x 8 GB)

G.Skill has announced that its new Rocket Lake and Z590 kits have been validated on the ASUS ROG Strix Z590-E Gaming WIFI, the ASUS ROG Maximus XIII Apex, and MSI’s MEG Z590I Unify motherboards with an Intel Core i9-11900K processor. G.Skill also stated that its DDR4-4800 CL17 16 GB (2 x 8 GB) kit uses Samsung B-die memory chips but didn’t specify if this was the case across its range.

At the time of writing, G.Skill hasn’t given us any pricing, but they are expected to launch in Q2 2021. With memory prices set to rise throughout the year, these kits aren’t likely to be cheap. The G.Skill Trident Z Royal and Trident Z RGB will likely feature at the higher end of the pricing spectrum, with its Ripjaw Z series sitting as its entry point.

Related Reading

Designed with a focus on Intel's latest 11th generation Rocket Lake processors and the new memory controller ratios, G.Skill has announced a wave of new memory kits designed to squeeze as much performance out of the platform. The new memory kits for Z590 and Rocket Lake feature speeds of up to DDR4-5333. They will be made available across multiple lines of its range, including the premium Trident Z Royal, Trident Z RGB, and the more affordable Ripjaw V series.

With memory performance and control getting some extra features with Intel's 11th gen desktop, the Z590 chipset with Rocket Lake processors now supports geared memory ratios between the memory controller and the DRAM data rates. The ability of Intel's memory controller in a 1:1 gear ratio can vary, certainly under ambient cooling methods, and not all of Intel's silicon can handle such high frequencies. This is where the gear ratio option becomes beneficial, taking some of the strain off the memory controller and allowing for high frequencies, with G.Skill capitalizing on this with its new memory kits up to DDR4-5333.


G.Skill's Trident Z Royal DDR4 Memory in Gold

The new G.Skill memory kits designed for Intel's Z590 (with Rocket Lake) start from DDR4-4266 with CL19 ratings, with two available capacities: dual-channel 32 GB (2x16) and 64 GB (2x32) kits. Also set to be available include DDR4-4400 kits with CL17 and CL18 latencies, including an operating voltage of 1.50 V in both the 32 GB and 16 GB kits.

Moving up, there's one kit of DDR4-4600 with CL20 with a total capacity of 64 GB (2 x 32 GB) and three different flavors of DDR4-4800; CL17 and CL18 with 2 x 8 GB kits, and CL20 with 2 x 16 GB. There's one 32 GB (2 x 16 GB) kit at DDR4-5066 with CL19 and an operating voltage of 1.6 V, with one kit maxing out at DDR4-5333 and CL21 latencies, with 2 x 8 GB memory sticks.

G.Skill Memory For Intel Z590 (Rocket Lake)
Rating (MT/s) Latency Voltage Capacity
DDR4-4266 19-26-26-46
19-26-26-46
1.45 V
1.50 V
32 GB (2 x 16 GB)
64 GB (2 x 32 GB)
DDR4-4400 17-18-18-38
18-24-24-44
1.50 V
1.50 V
32 GB (2 x 16 GB)
16 GB (2 x 8 GB)
DDR4-4600 20-30-30-50 1.50 V 64 GB (2 x 32 GB)
DDR4-4800 17-19-19-39
19-28-28-48
20-30-30-50
1.60 V
1.50 V
1.55 V
16 GB (2 x 8 GB)
16 GB (2 x 8 GB)
32 GB (2 x 16 GB)
DDR4-5066 20-30-30-50 1.60 V 32 GB (2 x 16 GB)
16 GB (2 x 8 GB)
DDR4-5333 22-32-32-52 1.60 V 16 GB (2 x 8 GB)

G.Skill has announced that its new Rocket Lake and Z590 kits have been validated on the ASUS ROG Strix Z590-E Gaming WIFI, the ASUS ROG Maximus XIII Apex, and MSI's MEG Z590I Unify motherboards with an Intel Core i9-11900K processor. G.Skill also stated that its DDR4-4800 CL17 16 GB (2 x 8 GB) kit uses Samsung B-die memory chips but didn't specify if this was the case across its range.

At the time of writing, G.Skill hasn't given us any pricing, but they are expected to launch in Q2 2021. With memory prices set to rise throughout the year, these kits aren't likely to be cheap. The G.Skill Trident Z Royal and Trident Z RGB will likely feature at the higher end of the pricing spectrum, with its Ripjaw Z series sitting as its entry point.

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Corsair Vengeance RGB Pro SL DDR4-3600 MHz CL18 2×8 GB Review

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Team Group T-Create Classic 10L DDR4-3200 MHz CL22 2×32 GB Review

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CES 2021: ADATA Claims to have DDR5 Module, But Sends Us Renders

Planning for the next-generation of processors, ADATA has sent us a render of its first DDR5 module at CES 2021, with supported speeds of up to DDR5-8400.

Memory partners and manufacturers during 2020 started to outline their plans for DDR5, including specifications and architecture. This includes announcements from the big three memory giants, including SK Hynix, Samsung, and Micron. ADATA has gone one step further and unveiled a render of what its DDR5 module could potentially look like, with a generic green PCB, with eight memory chips in two banks of four. This is despite the fact that we have already seen DDR5 engineering samples in the wild.


ADATA’s DDR5 Module render for CES 2021

ADATA states that it has has teamed up with both MSI and GIGABYTE to test its new DDR5 memory. This is to ensure that it has compatibility for DDR5 ready processors that will be announced. ADATA states its DDR5 memory can support speeds of up to 8400 MT/s, although this is likely to be at the launch and is in the upper range of what is expected on DDR5. Similarly with its 64 GB per module claim – this is DDR5 specification, and ADATA hasn’t shown us anything to suggest that initial modules will start at 64 GB capacities.

For more information about DDR5, check out the following:

ADATA hasn’t revealed which memory chips it intends to use for its modules, but all we know for now is that it will release DDR5 memory, and it will follow official specifications. 

Interested in more of the latest industry news? Check out our CES 2021 trade show landing page!

Planning for the next-generation of processors, ADATA has sent us a render of its first DDR5 module at CES 2021, with supported speeds of up to DDR5-8400.

Memory partners and manufacturers during 2020 started to outline their plans for DDR5, including specifications and architecture. This includes announcements from the big three memory giants, including SK Hynix, Samsung, and Micron. ADATA has gone one step further and unveiled a render of what its DDR5 module could potentially look like, with a generic green PCB, with eight memory chips in two banks of four. This is despite the fact that we have already seen DDR5 engineering samples in the wild.


ADATA's DDR5 Module render for CES 2021

ADATA states that it has has teamed up with both MSI and GIGABYTE to test its new DDR5 memory. This is to ensure that it has compatibility for DDR5 ready processors that will be announced. ADATA states its DDR5 memory can support speeds of up to 8400 MT/s, although this is likely to be at the launch and is in the upper range of what is expected on DDR5. Similarly with its 64 GB per module claim - this is DDR5 specification, and ADATA hasn't shown us anything to suggest that initial modules will start at 64 GB capacities.

For more information about DDR5, check out the following:

ADATA hasn't revealed which memory chips it intends to use for its modules, but all we know for now is that it will release DDR5 memory, and it will follow official specifications. 

Interested in more of the latest industry news? Check out our CES 2021 trade show landing page!

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TeamGroup Announces Intentions for DDR5, ELITE DDR5-5200 in 2021

Earlier in the year, we learned that a lot of DDR5 manufacturing is already in the pipeline, with Samsung, SK Hynix, and Micron all making announcements this year regarding their respective DDR5 plans. All of this speculation points to a 2021 launch, and to our surprise one of the module manufacurers is leading a charge. TeamGroup today is making an official statement revealing its plans to launch its ELITE series product lines, starting with DDR5-4800 modules and moving up to DDR5-5200.

Since the official specifications of DDR5 have been published by JEDEC, the initial standards include DDR5-3200 all the way to DDR5-6400, with future standards of up to DDR5-8400 expected. However, the full specifications haven’t been unveiled. In October, we examined information on sub-timings and latency with DDR5, and we also saw SK Hynix’s announcement of its DDR5-4800 memory

TeamGroup is a module manufacturer, and it has signaled its intentions to manufacture its first DDR5 under its popular ELITE series. The TeamGroup ELITE DDR5 series will first be available in 16 GB DDR5-4800 modules, with an operating voltage of 1.1 V, which is down from 1.2 V compared to the previous generations. TeamGroup states that this is an increase of up to 1.6 times the performance compared to its current memory (4800/3000 = 1.6), reducing 10% in power consumption. However, it doesn’t specify whose DDR5 chip it will use, although this is likely to be unveiled at a later date.

As we know from the official DDR5 specifications, each module will include on-die ECC for cell-to-cell data coherence (module-wide ECC is still optional). There are also two channels on each DDR5 memory stick. This is similar to LPDDR4 and GDDR6, with DDR5 opting for two independent 40-bit channels per module. These will still be based on the 288 pin design as DDR4 but will include different pinouts and notches/keying.

It looks as though TeamGroup is in full control of its expected DDR5 launch, which they state is likely to be in Q3 2021. It hasn’t provided specific details about its ELITE DDR5 series, but there is a lot of time between now and the third quarter of next year, and we expect to hear much more information sometime within the next few months. The fact that ELITE is a consumer brand suggests that TeamGroup knows we will be seeing a consumer-grade processor around that time with DDR4, but ELITE is also the base bare-PCB variant, which might be focused more to base enterprise models instead.

Related Reading

Earlier in the year, we learned that a lot of DDR5 manufacturing is already in the pipeline, with Samsung, SK Hynix, and Micron all making announcements this year regarding their respective DDR5 plans. All of this speculation points to a 2021 launch, and to our surprise one of the module manufacurers is leading a charge. TeamGroup today is making an official statement revealing its plans to launch its ELITE series product lines, starting with DDR5-4800 modules and moving up to DDR5-5200.

Since the official specifications of DDR5 have been published by JEDEC, the initial standards include DDR5-3200 all the way to DDR5-6400, with future standards of up to DDR5-8400 expected. However, the full specifications haven't been unveiled. In October, we examined information on sub-timings and latency with DDR5, and we also saw SK Hynix's announcement of its DDR5-4800 memory

TeamGroup is a module manufacturer, and it has signaled its intentions to manufacture its first DDR5 under its popular ELITE series. The TeamGroup ELITE DDR5 series will first be available in 16 GB DDR5-4800 modules, with an operating voltage of 1.1 V, which is down from 1.2 V compared to the previous generations. TeamGroup states that this is an increase of up to 1.6 times the performance compared to its current memory (4800/3000 = 1.6), reducing 10% in power consumption. However, it doesn't specify whose DDR5 chip it will use, although this is likely to be unveiled at a later date.

As we know from the official DDR5 specifications, each module will include on-die ECC for cell-to-cell data coherence (module-wide ECC is still optional). There are also two channels on each DDR5 memory stick. This is similar to LPDDR4 and GDDR6, with DDR5 opting for two independent 40-bit channels per module. These will still be based on the 288 pin design as DDR4 but will include different pinouts and notches/keying.

It looks as though TeamGroup is in full control of its expected DDR5 launch, which they state is likely to be in Q3 2021. It hasn't provided specific details about its ELITE DDR5 series, but there is a lot of time between now and the third quarter of next year, and we expect to hear much more information sometime within the next few months. The fact that ELITE is a consumer brand suggests that TeamGroup knows we will be seeing a consumer-grade processor around that time with DDR4, but ELITE is also the base bare-PCB variant, which might be focused more to base enterprise models instead.

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